1. Aluminum nitride ceramic substrate has the advantages of high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance and low dielectric loss. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.
2. Aluminum nitride has high hardness, surpasses traditional alumina, and can be used for new wear-resistant ceramic materials.
3. Using the optical properties of aluminum nitride, it can be used as an infrared window. Aluminum nitride film can be made into high-frequency piezoelectric elements, ultra-large scale integrated circuit substrates, etc.
4. Aluminum nitride ceramics have heat resistance, resistance to molten metal erosion, and are stable to acids. They can be used as crucibles and sintering mold materials for smelting metals such as aluminum, copper, silver, and lead.
Application of aluminum nitride ceramic substrate
2020 04/08