What is the trend of silicon nitride ceramic substrates in the semiconductor market today?
Silicon nitride ceramic substrate
In the domestic market, aluminum oxide and aluminum nitride ceramic substrates have been industrialized, and some medium-sized enterprises that can Ceramic Part supply stably in batches have also developed. However, for silicon nitride ceramic substrates, the progress of the domestic market is relatively backward. High-volume availability of silicon nitride substrates has not been achieved. Relatively speaking, there is a big gap between domestic silicon nitride raw material preparation, ceramic substrate batch process research and development and other technical levels compared with foreign countries. Silicon nitride ceramic substrates have become a bottleneck restricting the autonomous production Alumina Ceramic Plunger of important industries such as electric vehicles and LED lighting in my country.
High-strength silicon nitride insulating materials can meet the growing demand for longer life and higher thermal performance in power modules. Take the power module design as an example, in which the chip temperature rises from 150°C to 200°C, the Alumina Ceramic Ring switching loss can be reduced by 10%, and the higher operating temperature also puts forward higher requirements for the thermal conductivity of the substrate. New packaging technologies such as bonded modules make current substrates (mainly aluminum oxide and aluminum nitride) the weak link, and the use of silicon nitride ceramic substrates with excellent flexural strength, high fracture toughness and good thermal conductivity can make Higher device reliability, better thermal cycling capability, and longer lifetime.
The thickness of the silicon nitride substrate affects the insulation. When the thickness of the silicon nitride ceramic substrate is reduced to 0.30mm, the insulation cannot be fully guaranteed. It provides high thermal conductivity with a thermal conductivity of 50W/mK or more and a three-point bending strength of 600MPa or more. The conductive thin silicon nitride ceramic substrate has a thickness of 0.1 to 0.7 mm, preferably 0.1 to 0.3 mm. Silicon nitride ceramic itself has many excellent properties such as high hardness, high strength, low thermal expansion coefficient, good oxidation resistance, Alumina Ceramic Tube good thermal corrosion performance, low friction coefficient, and similar to the metal surface lubricated with oil, and it is also the best comprehensive structure. Ceramic material.
Nowadays, with the rapid development of information technology, the integration of integrated circuits is getting higher and higher, and the density of wiring is getting higher and higher. If the electronic packaging substrate cannot dissipate heat in time, a large amount of heat will accumulate on the integrated circuit, which will eventually lead to its failure and damage. Therefore, the thermal conductivity of the substrate is extremely important. Silicon nitride ceramics are structural ceramic materials with the best comprehensive properties. The theoretical thermal conductivity of single crystal silicon nitride can reach more than 400W/mK. In addition, its excellent mechanical properties make silicon nitride ceramics expected to make up for the deficiencies of existing substrate materials such as aluminum oxide and aluminum nitride. In the application of electronic packaging substrates Great market prospects.
What are the advantages of silicon nitride ceramic substrates in the semiconductor market?
2022 06/06