◆The thermal expansion coefficient of the ceramic substrate is close to that of the silicon chip, which can save the transition layer Mo film, save labor, material and reduce cost;
◆Reduce the solder layer, reduce the thermal resistance, reduce the void, and improve the yield;
◆ The line width of 0.3mm thick copper foil is only 10% of ordinary printed circuit board under the same current carrying capacity;
◆ Excellent thermal conductivity, which makes the chip package very compact, which greatly increases the power density and improves the reliability of the system and device;
◆ Ultra-thin (0.25mm) ceramic substrate can replace BeO, no environmental toxicity problem;
◆The current carrying capacity is large, 100A current continuously passes through the 1mm wide and 0.3mm thick copper body, and the temperature rise is about 17°C; the 100A current continuously passes through the 2mm wide and 0.3mm thick copper body, and the temperature rise is only about 5°C;
◆The thermal resistance is low, the thermal resistance of the 10×10mm ceramic substrate is 0.63mm, the thermal resistance of the ceramic substrate is 0.31K/W, the thermal resistance of the 0.38mm thick ceramic substrate is 0.19K/W, and the thickness of the 0.25mm ceramic substrate The thermal resistance is 0.14K/W.
◆ High insulation withstand voltage to ensure personal safety and equipment protection.
◆ New packaging and assembly methods can be implemented to make the product highly integrated and compact.
(1) Mechanical properties
It has high mechanical strength and can be used as a supporting member in addition to components. It has good processability and high dimensional accuracy; it is easy to achieve multi-layering;
The surface is smooth, free of warpage, bending, microcracks, and the like.
(2) Electrical properties
Insulation resistance and insulation breakdown voltage are high;
Low dielectric constant;
Low dielectric loss;
Stable performance under high temperature and high humidity conditions ensures reliability.
(3) Thermal properties
High thermal conductivity;
The coefficient of thermal expansion matches the relevant material (especially with the coefficient of thermal expansion of Si);
Excellent heat resistance.
(4) Other properties
Good chemical stability; easy metallization, strong circuit pattern and adhesion;
Non-hygroscopic; oil-resistant, chemical-resistant; a-ray release is small;
The substances used are non-polluting and non-toxic; the crystal structure does not change within the temperature range of use;
Rich in raw materials; mature technology; easy to manufacture; low price.
Advantages of ceramic substrates
2019 10/23