When hot-pressing 95% alumina ceramic, what raw materials can be added to increase thermal conductivity? The selection of materials can be approached from the following perspectives:
1. Consider the required performance characteristics of the product – improve electrical conductivity.
2. Consider the intended use of the product – if this 95% alumina ceramic is used as a circuit board, its insulation or other electrical properties should not be reduced by adding this substance.
3. Consider the manufacturing process – the sintering environment of the added substance must match the original, the particle size of the added substance must be the same, etc.
4. Consider the cost – is the added cost reasonable compared to the product's selling price?
Consider adding a small amount of SiC powder or metallic Al powder to make multiphase ceramics; will SiC powder make the color unappealing? Is the particle size of Al powder easy to control?
The required bulk density can be reduced, but for factory hot die casting production, ball milling cannot be changed.
SiC has good thermal conductivity, but it has good insulation properties.
Adding aluminum powder during sintering may cause it to oxidize into alumina ceramic petroleum fittings.
The thermal conductivity of alumina ceramic nozzles is limited; adding too little silicon carbide has little effect, while adding too much affects sintering. It's a very troublesome problem. If it could be solved, the industry would likely advance by leaps and bounds. For the substrate, you can only reduce the thickness to reduce thermal resistance, but its brittleness makes it difficult to make thinner ones. Adding Al will ruin the insulation of your injection molding process, so it's better to use Al directly; ceramic needle gauges have good thermal conductivity.